A Novel Approach for Production Challenges of Flexible Microstrip Patch Antenna

A Novel Approach for Production Challenges of Flexible Microstrip Patch Antenna

Brilliant Engineering (BEN)
Volume 1 - Issue 1 - January 2020

Hilal Koç Polat Dilruba Geyikoğlu Bülent Çavuşoğlu Mehmet Ertuğrul

Abstract

It is unavoidable to decrease the thickness of the substrate in order to obtain enough flexibility. Decreasing the height of the substrate lowers the gain of antenna and its bandwidth. Thus, it is challenging to provide operability for the flexible materials and it requires new approaches. This paper is shown that the using nano silver paste for the designed antenna causes better return loss rates (S11) and bandwidth. Also, the effect of sintering temperatures on the response of the antenna is analyzed for the range of 150 ° C to 350 ° C. The highest resonance frequency and the lowest return loss are observed at 350 ° C in this range. The SEM images of the antenna surfaces show that the nanoparticles in the paste group together with increasing sintering temperatures. When compared to the perfect conductor silver, better return loss and bandwidth are obtained.

Keywords

Patch antenna, silver, flexible, IoT, sintering
https://doi.org/10.36937/ben.2020.001.002